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MEMS Analysis

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MEMS devices present distinctive challenges in both solid modeling and analysis.  Schiller Engineering has the competence to provide useful designs and modeling to guide the MEMS device development process.  We use SolidWorks for its ability to handle feature sizes across many orders of magnitude, including sub-micron deposition layers.  We also employ a full suite of COSMOS tools to predict performance.  With an eye toward stiction effects and clearances required for micro-machining, we can follow your design rules (or those of your fabricator) or use our generic design rules.

"We wrote the white paper" on designing and analyzing MEMS devices with SolidWorks products.  See the white paper "Solid Modeling and Analysis of MEMS Structures" from the SolidWorks "Success Stories" page of the SolidWorks "Customer Successes" section.

Download the zipped AVI file (by clicking the thumbnail) showing developing stress in a MEMS "diving board" structure (similar to an accelerometer for vehicle airbag sensors).  The modeled device has a one-micron-thick nickel diving board over a five-micron-deep well in a silicon substrate.  The maximum stress predicted is 6.9 x 107 N/M2.

                    

The dimensions may be varied for a parametric design study.  The etched silicon structure below shows typical dimension naming conventions.  A larger version of the image is available by clicking the thumbnail.  A description of such a study is available here: MEMS Design Study.

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Last modified: 11/30/07